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Semiconductor
Semiconductor equipment preemptively responding to various memory and non-memory application demands
Jusung Engineering’s ALD equipment achieves uniform and high-quality thin films at temperatures below 300°C, regardless of complex underlying structures, across processes such as ultra-fine DRAM, 200+ layer 3D NAND, and sub-10nm logic devices.
As technology migration accelerates, precision control of thin films in confined spaces is essential. Jusung’s unique ALD core technology responds to the demands of both memory and non-memory applications. This technology also integrates with display technologies (converting electrical energy into light energy) and solar technologies (converting light energy into electrical energy).
Why ALD?
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01
Deposition Temperature Free
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02
Particle & Contamination Free
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03
Physical Properties Control
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04
Electrical Properties Control
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05
Interface Control
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06
Step Coverage Control
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07
Selective Deposition
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Optical Properties Control
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09
Designable
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10
Grain Condition Control
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Best Quality Film at Nano Scale
Introduction of item
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SDP System (ALD & CVD)
Plasma equipment with a new concept of zero-damage, maximizing productivity
The SDP System can deposit thin films on 5–6 wafers simultaneously in a single chamber.
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Guidance Series (ALD & CVD)
Next-generation semiconductor equipment adaptable to a wide range of process windows
The Guidance Series can adjust step coverage ratios and film stress while enabling recipe flexibility through space-time modulation. It efficiently achieves optimal conditions required by the latest devices.
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Eureka
Next-generation semiconductor equipment enabling ultra-pure deposition films
As an epitaxial (Epi) tool, Eureka enhances deposition speed, maximizing production efficiency.
JUSUNG
ENGINEERING